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mechatronic systemtechnik and ProTec Carrier Systems complement one another in the field of the handling of thin substrates

2011-04-20: The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.

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Welcome to ProTec Carrier Systems GmbH

ProTec Carrier Systems offers solutions for handling and processing of thin and ultra-thin (<50 µm) substrates, specifically wafers, based on its proprietary Transfer ElectroStatic Carrier (T-ESC®) Technology.

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T-ESC<sup>®</sup>
T-ESC®
Thin substrate on High-Temp. T-ESC<sup>®</sup> 4“ before chucking
Thin substrate on High-Temp. T-ESC® 4“ before chucking
Total bow elimination on the whole surface after chucking procedure
Total bow elimination on the whole surface after chucking procedure
Display Substrate
Display Substrate
Display Substrate on Customized Polymer T-ESC<sup>®</sup>
Display Substrate on Customized Polymer T-ESC®
Compound Wafer
Compound Wafer
Sollar Cell Substrate
Sollar Cell Substrate
SiC / Silicon Carbide
SiC / Silicon Carbide
Pseudo-squared Solar Cell Substrate on High-Temp. T-ESC<sup>®</sup> 8
Pseudo-squared Solar Cell Substrate on High-Temp. T-ESC®
Litho HT T-ESC<sup>®</sup>
Litho HT T-ESC®
HT T-ESC<sup>®</sup>
HT T-ESC®
Chucking Module CM 3000
Chucking Module CM 3000
Manual Chucking Unit MCU 3000
Manual Chucking Unit MCU 3000
Working Plate for MCU 3000
Working Plate for MCU 3000
Rackets
Rackets
Side Table
Side Table
Adapter Side Table
Adapter Side Table