AUTOMATED CHUCKING SYSTEMS
Automated chucking system for use in three different ways:
- individual chucking module CM 3000,
integrable into other existing systems, e.g. process tools
- fully automated chucking unit ACU 3000
- stand-alone chucking unit SCU 3000
Technical Features
- Non-contact substrate/wafer handling as per
Bernoulli’s principle with high precision alignment
- Throughput of up to 120 carrier packages per hour
Process Media
| Power supply |
100–240 V |
| Pneumatics |
N₂ or CDA |
| Vacuum |
|
Clean Room Class |
100, 10 |
Communication |
SEMI Standard SECS/GEM |
Applications |
Silicon wafers in size 6", 8", and 12" as well as other substrates |
