BACK SIDE GAS COOLING HT T-ESC®
(MEMBER OF THE HT T-ESC® FAMILY)
Optimized for processing of clamped thin wafers during exothermal processes with controlled temperature development due to active and direct Back Side Gas Cooling (He/Ar) of the thin wafer device.
The same applications supported through the standard HT Carrier are likewise supported by the BSGC HT T-ESC®.
Typical Applications
- Metal deposition (Cu/Ta, etc.)
- Dry etching (DRIE/RIE)
- High dosis/energy implant
Qualified Equipment
- AMAT Endura
- STS Pegasus
|
|
