Basics

PCS’s Transfer ElectroStatic Carrier (T-ESC^®) Technology provides safe and easy handling as well as processing of thin and ultra-thin substrates. T-ESC^® Technology is based on using an electrical field to apply an electrostatic force (Coulomb force) on materials of rather low con- ductivity. The mobile electrostatic carriers (T-ESC^®) developed by PCS establish such a field and chuck especially thin substrates (< 50μm) over a long period of time (up to 50 hours). The quick release at the end of the process leaves absolutely no contaminants on the substrate. Organic residues caused by the use of tape or by bonding – therefore requiring additional cleaning processes – are thus avoided. All existing standard tools, equipment, and processes remain fully utilizable. Warping and bowing of thin substrates are avoided during the entire process thanks to carrier protection. PCS offers a great variety of carriers suitable for many processes in the semiconductor and photovoltaic manufacturing industry.