Business Areas
T-ESC®
ProTec’s Transfer Electrostatic Carrier (T-ESC®) Technology provides safe and easy handling of thin materials. T-ESC® Technology is based on using an electrical field to apply an electrostatic force (Coulomb force) on materials of rather low conductivity. The mobile electrostatic carriers (T-ESC®) developed by PCS establish such a field and chuck especially thin and ultra-thin (< 50µm) substrates over a long period of time (up to 50 hours). The quick release at the end of the process leaves absolutely no contaminants on the substrate. Organic residues caused by the use of tape or by bonding – therefore requiring additional cleaning processes – are thus avoided. All existing standard tools, equipment, and processes remain fully utilizable.
Warping and bowing of thin materials are avoided during the entire process thanks to carrier protection. PCS offers a great variety of carriers suitable for many processes in the semiconductor and photovoltaic manufacturing industry.
Chucking Systems
ProTec Carrier Systems GmbH offers manual as well as automated solutions to facilitate Transfer Electrostatic Carrier (T-ESC®) usage for handling and processing thin and ultra-thin (<50µm) substrates, specifically wafers. Besides ProTec’s well-established manual chucking unit MCU 3000 for the chucking/de-chucking of wafers onto carriers, a newly developed automated chucking system is now available. It can be implemented in three different ways:
- as a fully Automated Chucking Unit ACU 3000 with sorter/handler function
- as a Stand-alone Chucking Unit SCU 3000 with semi-automated handling
- as an individual Chucking Module CM 3000, integrable into other existing systems, e.g. process or handling tools
The manual handling process can be protected by a wide range of ProTec Rackets. A Racket combines the functionality of a mobile electrostatic carrier (T-ESC®) with a mobile handheld charging unit integrated into a handling grip. One-hand operated, the Racket is capable of transporting thin substrates through temporary clamping without damaging the edge or surface.

