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mechatronic systemtechnik and ProTec Carrier Systems complement one another in the field of the handling of thin substrates

2011-04-20: The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.

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Fully Automated Chucking Unit ACU 300X

RZ_Poster_No_1_ACU.pdf RZ_Poster_No_1_ACU.pdf (5.8 MB)

Manual Chucking Unit MCU 300X

RZ_Poster_No_2_MCU3000.pdf RZ_Poster_No_2_MCU3000.pdf (6.3 MB)

Transfer Electrostatic Carrier (T-ESC®)

RZ_Poster_No_3_T-ESC.pdf RZ_Poster_No_3_T-ESC.pdf (8.8 MB)