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Transfer Eletrostatic Carrier T-ESC^®
- High-Temperature T-ESC^®
- Litho HT T-ESC^®
- Plasma-Resistant HT T-ESC^®
- Back Side Gas Cooling HT T-ESC^®
- Polymer T-ESC^®
- Glass Fiber T-ESC^®
Handling and Chucking Systems
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Latest News

mechatronic systemtechnik and ProTec Carrier Systems complement one another in the field of the handling of thin substrates

2011-04-20: The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC^®-Technology.

GLASS FIBER T-ESC^®

Bipolar carrier based on glass fiber

Enables tape-free grinding as well as thinned substrate/wafer handling in a protected manner after the grinding process is completed
Resistive against slurry
Flatness (TTV) < 2 μm

Typical Applications

Grinding
Optical inspection
Probing

Qualified Equipment

Disco DFG 840/850
G & N Multinano 3-300