HIGH-TEMPERATURE T-ESC® (HT T-ESC®)
Unipolar carrier based on silicon wafers
- Solution for thin wafer support during processes involving high-temperature impact (up to 450°C), vacuum, and plasma environment
- Compatible with common bipolar stationary chucks
Typical Applications
- PVD/CVD
- Implanting
- Implanting
- Lithography (partially)
- Plasma cleaning
- Electroplating
- Annealing of wafer surface
Qualified Equipment
- STS Pegasus
- Varian E500
- Semitool Equinox
- Oxford Plasmalab 80 Plus
- BCP LLS802
- Applied Materials PVD Cluster Tool
- Various CVD tools
- etc.
Additional Information
The HT Carrier is a standard silicon wafer adhering to SEMI stan- dards. By applying a specific coating to the bulk material (using standard semiconductor materials), the High-Temperature wafer support system for thin and ultra-thin substrates is achieved.
Advantages of HT T-ESC®
- Low contamination
- High flatness
- Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors, etc.)
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