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mechatronic systemtechnik and ProTec Carrier Systems complement one another in the field of the handling of thin substrates

2011-04-20: The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.

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MANUAL CHUCKING UNIT MCU 3000

Manually operated electrostatic chucking/de-chucking unit

Available in three basic sizes: 4”/6”, 6”/8”, and 8”/12”

Additional Information

  • Working plate on top of the unit determines the substrate/wafer size
  • Change of size by replacing working plate to upgrade from 4” to 6”, 6” to 8”, 8” to 12”, or to downgrade from 6” to 4”, 8” to 6”, 12” to 8”
  • Chucking voltage is programmable up to 3 kV
  • Enhanced SIEMENS PLC S7/200 controller contains the GUI and several (self-)diagnostic features
  • LCD touch-screen panel includes selectable screen display for voltage, current, and status information, customer’s chucking type settings and process conditions, etc.
  • Parameter configuration settings are stored in customized data records for each carrier type

Technical Data

Process Media

Power supply
N₂ (CDA/compressed air)
Vacuum

Machine Dimensions L x W x H: 621 x 430 x 330 mm
Weight 12,5 kg
Size

4”, 6”, 8”, 12”, customized solutions, e.g. square-shaped solar cells
156 x 156 mm