PLASMA-RESISTANT HT T-ESC®

(MEMBER OF THE HT T-ESC® FAMILY)

Enables longer processing times for clamped thin wafers in plasma processes thanks to adapted and optimized edge protection.

Typical Applications

  • Typical Applications
  • Dry etching (DRIE/RIE)
  • Metal deposition

Furthermore, the same applications supported by the standard HT Carrier are also supported by the PR HT T-ESC®.

Qualified Equipment

  • STS Pegasus
  • Varian E500

Option: Adapter PR HT T-ESC®

Enables in addition to the benefits of PR HT T-ESC® also the possibility to handle and process smaller-sized substrates on bigger-sized tools, e.g. 6” sample on 8” tool.

Plasma-Resistant HT T-ESC®
Adapter PR HT T-ESC®