POLYMER T-ESC®

Consists of compounded polyimide foils with embedded and sealed copper layers

  • Protects against penetration by liquids between wafer and carrier
  • Resistive against commonly used chemicals in semiconductor manufacturing

Typical Applications

  • Spin etching
  • Spin cleaning
  • Spin coating
  • Optical inspection
  • Probing

Qualified Equipment

  • SEZ: RST 101, RST 102, RST 103