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mechatronic systemtechnik and ProTec Carrier Systems complement one another in the field of the handling of thin substrates

2011-04-20: The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.

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Process Applications

Chuckable Substrates

  • Chuckable Substrates
  • Standard wafers (semiconductor, photovoltaic)
  • Thin wafers (50 μm tested), Taico wafers
  • “Compound wafers”
  • GaAs/SiC (with or without GaN)
  • Chuckable Substrates
  • Pyrex 7740
  • Bonded wafers
  • Masks (e.g. stencil)