RACKET UNIPOLAR
General Information
- Vacuum must be switched on for clamping a
substrate/wafer and switched off for releasing it - De-chucking can also be performed by backside purge
- During handling, substrates/wafers are protected
through the whole racket surface area - Flat/Notch marker supports manual pre-alignment
Technical Data
| Process Media | Compressed air |
| Sizes | 4”, 6”, 8”, 12”, customized solutions, |
STANDARD RACKET
TAICO RACKET
- Capable of clamping a Taico-shaped substrate/wafer by means of vacuum and transporting or transferring it onto a unipolar carrier (T-ESC®)
- Contacts a Taico substrate/wafer during chucking onto a unipolar carrier by touching the cavity in the whole Taico substrate/wafer area
Additional Information
The design facilitates good contact to the Taico wafer bottom and provides excellent protection for the whole Taico substrate/wafer surface during handling.
Two designs are available
Design 1: Edge Racket with needles
Contacting tool with minimum contact area. During chucking/de-chucking, the substrate/wafer is touched at the edge by 4 contact needles only.
Additional Information
This design is useful when the substrate has a non-conductive coating, e.g. photoresist. Only 4 small openings are needed to achieve unipolar contact.
Design 2: Edge Racket with annulus
Handling and contacting tool with minimum contact area that contacts the substrate/wafer only in the standard edge area (~4,0 mm).
ADAPTER EDGE RACKET
Special unipolar racket, similar to the Edge Racket with annulus, conceived to handle a substrate/wafer of smaller size in combination with a unipolar carrier of larger size, e.g. wafer 6” on carrier 8” (adapter function).
Additional Information
Purpose is to process smaller wafers in systems or tools of larger size (bridging tool). In order to center the smaller substrate in the carrier, the Adapter Side Table is essential.
Technical Data
Sizes: 4“ to 6“, 6” to 8”, 8” to 12”, customized solutions



