TRANSFER ELECTROSTATIC CARRIER (T-ESC®)
T-ESC® Technology offers safe and easy handling as well as processing
of thin and ultra-thin substrates. The basic concept behind this
reversible chucking technology involves using electrostatic force to
clamp thin and ultra-thin flexible wafers onto robust carriers (T-ESC®).
Such wafer-carrier packages can be handled and processed like wafers of
standard thickness. Therefore, existing standard cassettes, handling
tools, and fabrication equipment can be used without modifications. Warp
and bow of thin and ultra-thin substrates are eliminated.
PCS offers different types of carriers (T-ESC®) applicable to a great variety of process applications.
Technical Data:
- All carriers are available in sizes 4”, 6”, 8”, and 12” according to the SEMI standards
- Moreover, non-standard sizes, substrates for photovoltaic purposes, or display applications can be customized
